100% solids, liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well suited as a damming product for low viscosity encapsulants & other bonding uses requiring minimal flow during curing. Dimensional stability, low stress, & thermally curable.

MSDS / Technical Data Sheets / Product Literature

• dataData Sheet #927
• litHigh Performance Adhesives

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