EW8003 NoSWEEP? Wire Bond Encapsulant
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產(chǎn)品名稱: EW8003 NoSWEEP? Wire Bond Encapsulant
產(chǎn)品型號: EW8003
產(chǎn)品展商: Polysciences
產(chǎn)品文檔: 無相關(guān)文檔
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EW8003 NoSWEEP? Wire Bond Encapsulant
的詳細介紹
Structural epoxy adhesive with high strength & durability. Particularly useful for demanding bonding applications requiring very high performance properties. Tough, impact resistant, good adhesion to many metals, ceramics, & thermosetting plastics. Thermally curable.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #680
- litHigh Performance Adhesives