PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant
如果您對該產品感興趣的話,可以
產品名稱: PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant
產品型號: PC570
產品展商: Polysciences
產品文檔: 無相關文檔
簡單介紹
PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant
PC570 Rapid Heat Curing Epoxy Adhesive/Encapsulant
的詳細介紹
2 component epoxy designed for bonding, encapsulating, & sealing applications requiring high strength, high rigidity, & high Tg. Thermally curable.
MSDS / Technical Data Sheets / Product Literature
- dataData Sheet #934
- litHigh Performance Adhesives
